SKU: 10202900365

Opladen IC-module SN2611 SN2611AO voor iPhone 11/11 Pro / 11 Pro Max

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Description

Opladen IC-module SN2611 SN2611AO voor iPhone 11/11 Pro / 11 Pro MaxDeze Charging Battery management IC is een vervangend chip component voor reparatie op moederbordniveau. De chip regelt de stroom die van de oplader naar de batterij gaat. Bij een defecte charging IC kan het toestel niet meer opladen, laadt het traag, of wordt het tijdens het opladen heet. Deze chip (Texas Instruments SN2611 charging IC) wordt typisch ingezet in: iPhone 11, iPhone 11 Pro, iPhone 11 Pro Max. Specificaties Type: Charging Battery

Deze Charging / Battery management IC is een vervangend chip-component voor reparatie op moederbordniveau. De chip regelt de stroom die van de oplader naar de batterij gaat. Bij een defecte charging IC kan het toestel niet meer opladen, laadt het traag, of wordt het tijdens het opladen heet. Deze chip (Texas Instruments SN2611 charging IC) wordt typisch ingezet in: iPhone 11, iPhone 11 Pro, iPhone 11 Pro Max.

Specificaties

  • Type: Charging / Battery management IC
  • Chip-onderdeelnummer(s): SN2611, SN2611AO
  • Compatibel: iPhone 11, iPhone 11 Pro, iPhone 11 Pro Max
  • Toepassing: board-level micro-soldering / chip-rework
  • Verpakking: 1 stuks (los IC-component)

Symptomen die wijzen op een defecte charging ic

  • Toestel laadt niet of laadt extreem traag
  • Geen reactie bij aansluiten van lader
  • Toestel wordt warm bij het laden
  • Laadkabel/lader is OK maar batterij blijft leeg

Installatie

🔴 Moeilijk — micro-soldeerwerk met hete lucht (350-400°C), flux, soldeertin en stencil. Niet voor doe-het-zelf — vereist ervaring met chip-rework, board-level reparatie en ESD-veilige werkplek. Laat installeren door een gespecialiseerde micro-soldeerservice.

Veelgestelde vragen

Kan ik dit zelf installeren?
Nee — chip-vervanging vereist hete-lucht-soldeerstation (BGA rework), stencil, lood-vrij soldeertin en ervaring met board-level repair. Onveilig zonder de juiste apparatuur en kan andere componenten beschadigen.

Welke gereedschap is minimaal nodig?
Hot-air rework station (350-400°C), preheat-plaat (optioneel), microscoop of vergrootglas, ESD-veilige werkplek, flux paste, lood-vrij soldeertin 0.2-0.3mm en BGA-stencil voor reballing.

Is dit een originele chip?
Mackenners levert door de leverancier gecontroleerde IC-componenten. Voor mission-critical reparaties (Face ID, secure-enclave) raden wij aan eerst te overleggen met je reparateur over OEM versus aftermarket.

Shipping Notes
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Exchange/Return Notes
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  • Final sale items are not eligible for returns or exchanges.
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SKU: 10202900365

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