SKU: 60591450209

MECHANIC MagTin Magnetic Levitation Chip Tin Planting Platform

Sale price$14.03 Regular price$15.59
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Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Aug 27 - Sep 1

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Description

MECHANIC MagTin Magnetic Levitation Chip Tin Planting PlatformMECHANIC MAG Tin magnetic levitation chip tin planting platform CPU hard disk position steel mesh for iPhone series Huawei series Qualcomm series. Mechanical magnetic levitation chip tin planting platform with template is suitable for iPhone Huawei Qualcomm IC CPU Nand flash memory font re ball soldering. Option: 1. Standard set: MagTin positioning platform + iPhone A8 A15 CPU stencil(8pcs). 2. Qualcomm series stencil only(7pcs). 3. Huawei series

MECHANIC MAG Tin magnetic levitation chip tin planting platform CPU hard disk position steel mesh for iPhone series/ Huawei series/ Qualcomm series. Mechanical magnetic levitation chip tin planting platform with template is suitable for iPhone Huawei Qualcomm IC CPU Nand flash memory font re-ball soldering.


Option:
1. Standard set: MagTin positioning platform + iPhone A8-A15 CPU stencil(8pcs).
2. Qualcomm series stencil only(7pcs).
3. Huawei series stencil only(8pcs).


Features:
1. Strong Magnetic: According to the principle of magnetic levitation.
2. Automatically adsorbed and clamped the steel stencils.
3. Infinite Update: For all BGA chip tin planting, constantly updated.
4. Steel Stencils Set: iPhone series, Huawei series, Qualcomm series.
5. Premium Imported: High temperature resistance of 500°C no deformation or bulging 6. Made of AAAA grade steel, good flexibility.
7. Magnetic Module: Fix the chip in the upper left corner of the chip groove.
8. Make the magnetic module withstand the edge of the chip automatically. It can cover the corresponding chip stencil.


Support model:
1. iPhone A8/A9/A10/A11/A12/A13/A14/A15 CPU.
2. Qualcomm Snapdragon 865 large/888/855/845/765G/865 small/778
3. Huawei Hisilicon 960-HI 3660/985/820-HI 6290/L/970-HI 3670/9000-HI 3610/810-HI 6280/710-HI 6260/990-3690 5G/980-HI 3680.

Shipping Notes
  • Free Standard Shipping on $100+ Orders to the USA.
  • Except Preorder products are shipped in 48 hours.
  • Delivery to the USA:
  1. Standard Shipping : 3-10 business days
  • If time is of the essence, please consider selecting expedited delivery for faster service.
Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy
SKU: 60591450209

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4.3 ★★★★★
Based on 8 reviews
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Verified Purchase
chris cook
Alexandria, US
★★★★★ 5
Great, affordable upgrade
Style: 36 Sqft 80 mil
Easy to use and install. Great upgrade
WAS THIS REVIEW HELPFUL?YesReportShare
Reviewed in the United States on May 8, 2026
S
Verified Purchase
Sbushlnzl
Port Orchard, US
★★★★★ 5
Nice sound deadening, self adhesive mats
Style: 18 Sqft 80 mil
These mats should work fine for my application. I’m applying it to the back sides of the hollow core doors on the closet where my HVAC is installed to reduce the “hum” from passing through. If I were sound deadening my automobile, I would probably use a heavier gage material. Overall, good product at a reasonable price.
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Reviewed in the United States on March 21, 2026
V
Verified Purchase
vivian johnson
Phoenix, US
★★★★★ 5
Very good product
Style: 36 Sqft 80 mil
Easy to install, very sticky. Will buy again.
WAS THIS REVIEW HELPFUL?YesReportShare
Reviewed in the United States on May 20, 2026
S
Verified Purchase
Samantha
Charlottesville, US
★★★★★ 5
Works well and doesn’t break the bank
Style: 36 Sqft 80 mil
Awesome value for low budget wound deadening. Used this under the floor mat on my international 4300 and there is a noticeable difference in sound inside the cab.
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Reviewed in the United States on May 5, 2026
M
Verified Purchase
Miguel Rojas
New York, US
★★★★★ 5
It works
Style: 36 Sqft 80 mil
Great product
WAS THIS REVIEW HELPFUL?YesReportShare
Reviewed in the United States on May 9, 2026

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